Industry News: baking thick (Page 1 of 1)

Resin plug application and process

Industry News | 2019-05-16 01:24:13.0

With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.

Headpcb

Krayden, Inc. Announces that Humiseal UV40 Coating Is Available as a Gel

Industry News | 2010-06-11 15:24:29.0

DENVER, CO — Krayden, Inc., a leading distributor of engineered materials, announces that the popular Humiseal UV40 conformal coating is now available as a gel.

Krayden Inc.

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Your Guide to Process Defect of the Month

Industry News | 2016-08-19 05:00:52.0

If you have a process problem, let NPL Defect of the Month Video help you team

ASKbobwillis.com

Indium Corporation to Showcase High-Reliability Materials for Power Electronics at APEC

Industry News | 2024-02-19 12:00:05.0

Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.

Indium Corporation

Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West

Industry News | 2024-01-29 11:36:51.0

Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.

Indium Corporation

Indium Corporation to Feature High-Reliability Materials for Power Electronics at NEPCON Japan

Industry News | 2024-01-29 11:33:44.0

Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.

Indium Corporation

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

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