Industry News | 2022-02-10 17:06:48.0
Rafal Przeslawski, Xilinx takes top prize
Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
Industry News | 2023-06-26 09:36:30.0
IPC releases PCB industry results for May 2023
Industry News | 2023-09-11 17:56:34.0
IPC releases August 2023 Economic Outlook report
Industry News | 2023-10-02 10:15:07.0
IPC Releases PCB Industry Results for August 2023
Industry News | 2023-11-20 13:44:23.0
IPC APEX EXPO 2024 attendees can expand their global network and meet with electronics industry innovators and connect with peers throughout the show floor, in technical conference sessions, professional development courses, standards development meetings, special networking events, and social receptions at the Anaheim Convention Center, April 6–11, 2024. Registration is now open.
Industry News | 2019-10-02 16:32:48.0
Nordson ASYMTEK is pleased to introduce its Panorama™ conformal coating line solutions, providing a balance of equipment and process control for optimal efficiency in automated conformal coating.
Industry News | 2003-08-27 10:43:02.0
This 41-page document is the complete source for printed circuit board and electronics assembly standards and publications for design, materials, manufacturing, assembly, quality and test.
Industry News | 2004-10-30 23:50:28.0
Minneapolis, MN
Industry News | 2010-10-30 01:11:30.0
With only five months left in its development, the 2011 IPC International Technology Roadmap for Electronic Interconnections is paving its way to being the most controversial roadmap to date.
