Industry News | 2024-06-28 20:14:47.0
The MVP Aurora features Automated Inspection and Metrology for Packaged IC's, BGA's and Leaded Device's
Industry News | 2009-08-04 16:28:40.0
2 @ +/- 12.5µm and advanced speed and acceleration control to ensure robust processing of today’s delicate wafer products.
Industry News | 2003-04-16 10:58:03.0
Award presented for Palomar's Gold Connection
Industry News | 2020-01-07 11:42:27.0
Practical Components announces that it will showcase its advanced technologies at the IPC APEX exhibition in booth 1600 scheduled to take place February 4-6, 2020 at the San Diego Convention Center in San Diego California.
Industry News | 2014-08-12 16:03:12.0
(Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.
Industry News | 2008-02-15 15:10:03.0
DEK�s has appointed a new Process Manufacturing Engineer to further enhance its stencil production for customers. Kent Ang, an accomplished stencil specialist, has been promoted from Electroform Process Engineer to take on the new role in the company�s Asia Pacific division.
Industry News | 2015-11-03 10:54:44.0
LOS ALAMITOS, CA — November 2015 — Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces that it will showcase its latest technology in representative AAT Aston’s exhibit at Hall A2 Stand 578 scheduled to take place November 10-13, 2015 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2019-10-17 15:26:25.0
Practical Components announces that it will showcase its advanced technologies in representative AAT Aston’s exhibit at Hall A2 Stand 578 scheduled to take place November November 12-15, 2019 at the New Munich Trade Fair Center in Munich, Germany.
