Industry News | 2013-01-14 08:41:05.0
OK International will debut the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth #735 at the upcoming IPC APEX EXPO
Industry News | 2013-02-27 15:04:56.0
February 2013 ― OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2010-07-16 16:42:34.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, has released PB Swiss Tools’ Holding Ring Hex Keys. The new hex keys allow fasteners to be inserted or removed in hard-to-reach locations without the fastener falling off the tool and without sacrificing strength.
Industry News | 2014-03-03 12:56:31.0
Count On Tools Inc.announces that PB Swiss Tools now offers SAE Hex Keys (allen keys) that are color-coded according to size and function in its Rainbow assortment.
Industry News | 2015-02-18 08:04:06.0
Count On Tools introduces PB Swiss Tools’ smaller Hex Key (allen keys) sets that are color-coded according to size and function in its Rainbow assortment. The tools are distinctively differentiated from others; thus they can be located faster in the toolbox, at the workplace or on the construction site.
Industry News | 2003-05-27 08:13:23.0
The Ninth Annual Pan Pacific Microelectronics Symposium
Industry News | 2017-10-05 19:03:43.0
Count On Tools is pleased to announce that PB Swiss Tools now offers knurled hex keys as a standard option in their product catalog. The knurling at the shaft increases the non-slip property in wet or oily environments, thereby increasing the safety. The round shaft, manufactured from PB Tools’ unique steel alloy guarantees higher reverse fatigue strength. The new knurled hex keys from PB Swiss Tools is available in sizes 1.5mm –10mm as individual hex key l-wrenches or as a set in a handy plastic holder.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
