Industry News: balling and specification (Page 8 of 99)

IPC-HDBK-850 Sets Guidelines for Potting and Encapsulating Boards

Industry News | 2012-08-09 18:42:34.0

IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.

Association Connecting Electronics Industries (IPC)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2013-06-11 19:23:26.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open.

Surface Mount Technology Association (SMTA)

Yusaku Kono and Pierre-Emmanuel Goutorbe Receive IPC Rising Star Awards

Industry News | 2018-03-12 17:49:04.0

In recognition of their leadership and contributions to IPC and the electronics industry within the past five years, IPC – Association Connecting Electronics Industries® presented an IPC Rising Star award to Yusaku Kono, Japan Unix, and Pierre-Emmauel Gourtorbe, Airbus, at IPC APEX EXPO 2018.

Association Connecting Electronics Industries (IPC)

IPC Advocacy Helps Shape Final SEC Conflict Minerals Regulation Treatment of Scrap and Recycled Materials and Phase-In Period Secured

Industry News | 2012-08-22 18:22:19.0

Following years of advocacy, IPC and its members are relieved that the conflict minerals rule approved by the U.S.

Association Connecting Electronics Industries (IPC)

IPC Seeking Volunteers for 2003 Annual Meeting and Technical Conference

Industry News | 2003-04-17 11:32:31.0

Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

IPC, HKPCA Reschedule International Exhibition for PCB and Assembly Industries

Industry News | 2003-06-05 07:55:24.0

Due to the worldwide outbreak of severe acute respiratory syndrome (SARS).

Association Connecting Electronics Industries (IPC)

New Facility and Staffing Increases Capabilities for XDry

Industry News | 2008-11-18 17:58:20.0

Las Vegas NV, November 17, 2008- XDry Corporation has opened a new facility in Montreal to support sales and service in the Americas. The new facility is conveniently located 7 miles from the Montreal Pierre Eliot Trudeau International Airport and the TransCanada Highway at 6525 Vanden-Abeele, Ville St-Laurent, Quebec H4S 1S1.

XDry

IPC and IPCA Comment on India's Proposed E-Waste Rules 2010

Industry News | 2010-07-08 12:45:56.0

Working together to address the latest round of proposed substance restrictions, IPC and the Indian Printed Circuits Association (IPCA) have submitted comments in response to the Indian Government’s Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010.

Association Connecting Electronics Industries (IPC)

Count On Tools Launches Redesigned Online Catalog and Web Site

Industry News | 2013-08-01 12:59:51.0

Count On Tools (COT) Inc has launched its interactive online catalog and redesigned Web site.

Count On Tools, Inc.

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)


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