Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Industry News | 2013-04-13 00:16:30.0
Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.
Industry News | 2013-06-07 14:37:14.0
Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
Industry News | 2023-05-08 08:15:40.0
Aven is pleased to introduce its Accu-Cut cutters. These diagonal pliers or wire cutters are specially designed to make clean and precise cuts in tight spaces, making them an indispensable tool for electricians, DIY enthusiasts, and professionals in various industries.
Industry News | 2003-05-21 09:17:38.0
Enters into Licensing and Joint Development Alliance with ATMI
Industry News | 2007-12-05 23:40:50.0
BALVE, GERMANY � December 4, 2007 � The Balver Zinn Group, a leading provider of high-quality anodes with various alloys as well as soft solders and special wires, announces that it is positioning itself to develop the opportunities presented by the global license it has acquired for solder pastes and wire using the proven SN100C alloy developed by Nihon Superior Co. Ltd.
Industry News | 2013-03-06 10:33:14.0
Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2013-03-06 10:36:50.0
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2012-05-11 20:19:04.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Industry News | 2018-03-21 20:32:48.0
CAMI Research will again host professional development workshops at the Wire Processing Technology Expo in Milwaukee, and offer opportunities to win $500 in CableEye® accessories. These sessions will be held on the Tuesday - the EXPO set-up day. At the exhibit itself, CAMI will have hands-on exhibits for visitors to experience CableEye’s ease of use and flexibility, especially regarding automated testing.
