Industry News | 2015-11-03 10:54:44.0
LOS ALAMITOS, CA — November 2015 — Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces that it will showcase its latest technology in representative AAT Aston’s exhibit at Hall A2 Stand 578 scheduled to take place November 10-13, 2015 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2016-04-18 11:30:07.0
Kester will be represented through our German sales partners, ADL Prozesstechnik UG (booth # 7-426) and EURO TOOL GmbH (booth # 7-520), at SMT Hybrid Packaging 2016, which will take place April 26-28 at the Exhibition Centre in Nuremberg, Germany.
Industry News | 2018-10-02 17:16:16.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming iMAPS 2018 – Pasadena 51st International Symposium on Microelectronics exhibition and conference, scheduled to take place October 9-11, 2018 at the Pasadena Convention Center in California.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2021-03-03 14:17:42.0
New CIT Relay & Switch IP67 Process Sealed VM3S Series Snap-Action Switch Protects Against Environmental Distress
Industry News | 2010-09-29 01:30:07.0
FCT Assembly to highlight its leading solder pastes and stencil technologies in booth 226 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2012-02-22 01:47:58.0
Nihon Superior will introduce several new developments in soldering processes and materials in Booth #3044 at the upcoming IPC APEX Expo.
Industry News | 2012-09-05 13:53:47.0
Nordson DAGE announces that Keith Bryant, Global Sales Director X-ray Systems, will present “Recent Advances in X-ray Technology” at the upcoming Surface Mount & Light Emitting Diodes (SMALED) Conference
Industry News | 2019-01-04 16:38:36.0
Nihon Superior today announced plans to exhibit in Booth #1334 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29 - 31, 2019 at the San Diego Convention Center in Ca. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. SN100C (032) flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
