Industry News: barcodes copper wire (Page 4 of 19)

Polyonics to Debut New Technologies at SMTA Atlanta

Industry News | 2009-04-15 17:01:04.0

WESTMORELAND, N.H. � April 2009 � The leader in harsh environmental labels and product marking for industrial identification, Polyonics Inc. announces that it will debut several new technologies at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Polyonics, Inc.

Polyonics Premiers Four New Materials

Industry News | 2009-04-15 16:24:57.0

WESTMORELAND, N.H. � April 2009 �Polyonics introduces four new materials to help win over new and existing projects.

Polyonics, Inc.

Kester to Exhibit Leading Fluxes, Pastes and Wires at SMTA Atlanta

Industry News | 2009-04-13 16:23:27.0

ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester

BALVER ZINN Grants Sub-License to Estaños & Soldaduras Senra, S.L.U.

Industry News | 2014-03-12 13:55:52.0

BALVER ZINN today announced that it has granted a sub-license to Estaños Senra S.L. for the popular SN100C® alloy patented by Nihon Superior Co. Ltd. for manufacturing and sales throughout Spain.

Balver Zinn

Kester to Feature Lead-Free Information Center at APEX 2008

Industry News | 2008-02-29 16:42:42.0

ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.

Kester

Semikron Checks DCBs with Automatic Wirebond AOI from Viscom

Industry News | 2013-03-07 11:20:46.0

Semikron (SEMIKRON International GmbH) manufactures components and systems for power electronics.

Martel Marketing Communications, Inc.

Hesse & Knipps To Discuss "Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications" at SMTA Philadelphia Chapter Meeting

Industry News | 2012-05-30 13:50:20.0

Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.

Hesse Mechatronics

Nathan Trotter wins Global Technology Award for NT100Ge Solder Bar & Wire

Industry News | 2019-11-13 11:29:06.0

Nathan Trotter announces that it was awarded a 2019 Global Technology Award in the category of Solder Bar & Wire for its NT100Ge Solder Bar & Wire. The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.

Nathan Trotter & Co., Inc.

AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO

Industry News | 2013-01-15 16:31:41.0

– AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo,

AIM Solder

A New Low-Cost Conductive LED Die Attach Adhesive Is Now Available for Small Die and LEDs

Industry News | 2013-04-29 12:50:23.0

Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems, Inc.


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