Industry News: bare boards msl (Page 1 of 40)

Circuits West Invests in AOT

Industry News | 2003-03-28 08:46:12.0

The high scan speeds and fast setup times of the Excalibur system make it a good choice for this sector of the bare-board PCB manufacturing industry

SMTnet

Introbotics Announces New Board Testing Capability for Merix Corporation

Industry News | 2003-04-01 08:13:08.0

The Introbotics equipment boosts controlled impedance testing productivity and accuracy by a factor of ten compared to the handheld probing techniques.

SMTnet

IPC Names New Director of PWB Standards And Technology

Industry News | 2001-12-19 10:50:53.0

IPC has announced that Tom Newton has been named director of PWB Standards and Technology. In this position, Newton is responsible for new and existing standards in the areas of base materials and fabrication of printed circuit boards, as well as maintaining IPC involvement in new technologies in these same fields.

Association Connecting Electronics Industries (IPC)

Phoenix International and MSL Embrace IPC EMS Program Manager Certification Program

Industry News | 2003-02-22 13:30:35.0

Trains all levels of program managers within the EMS industry in operations, project management, finance, contract management and leadership skills.

Association Connecting Electronics Industries (IPC)

First-Ever Power Conversion Standard IPC-9592 Gets Update

Industry News | 2010-06-11 15:59:00.0

BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.

Association Connecting Electronics Industries (IPC)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

IPC and DPC Collaborate on Web Seminar

Industry News | 2003-04-29 07:30:06.0

Announce their plans to co-sponsor a free online conference on the current state of bare die packaging

Association Connecting Electronics Industries (IPC)

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?

Industry News | 2018-10-18 10:18:58.0

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?

Flason Electronic Co.,limited

Martin K. Anselm, Ph.D., to Present “Electronic Manufacturing Fundamentals” at SMTA Capital Chapter June Tutorial

Industry News | 2016-05-16 20:32:11.0

The SMTA Capital Chapter is pleased to announce it will welcome Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd to instruct a tutorial on SMT Principles at Zentech Manufacturing, an ITAR facility located at 6980 Tudsbury Road, Baltimore, MD, 21244. The tutorial is scheduled from 8:30 am to 4:00 pm and includes lunch and a tour. As Zentech is an ITAR facility only US Citizens can participate in the tour. This tutorial is designed for those involved in printed board design, bare board fabrication, SMT assembly, quality control, materials purchasing, and reliability testing. Registration is required for this learning event.

Surface Mount Technology Association (SMTA)

Courses at IPC ESTC to Explore Advanced Technology, Reliability and Product Performance Systems Approach to Product Realization Emphasized

Industry News | 2013-04-17 11:13:48.0

IPC ESTC will feature eight professional development courses examining packaging, materials, design and assembly considerations in electronics, from bare board to end-product, May 20–21 and May 23, 2013, at The New Tropicana in Las Vegas.

Association Connecting Electronics Industries (IPC)

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