Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2009-12-07 19:48:02.0
Techcon Systems invites visitors to Productronica 2009 to ‘TAP’ into Techcon Systems ‘Training’, ‘Application’ and ‘Productivity’ advantages with an impressive line up of the latest cost-saving fluid dispensing solutions. A leading global supplier of fluid dispensing systems and accessories, Techcon Systems will exhibit alongside Metcal and Oki branded products on the OK International Stand 127, Hall A4 at the bi-annual event, which is scheduled to take place 10th – 13th November at the New Munich Trade Fair Center in Munich, Germany. German companies will also be able to discuss Techcon Systems products at the show with German partner Globaco.
Industry News | 2012-07-25 15:16:14.0
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference
Industry News | 2016-04-18 11:30:07.0
Kester will be represented through our German sales partners, ADL Prozesstechnik UG (booth # 7-426) and EURO TOOL GmbH (booth # 7-520), at SMT Hybrid Packaging 2016, which will take place April 26-28 at the Exhibition Centre in Nuremberg, Germany.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
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