Industry News | 2013-03-12 14:11:50.0
After successfully launching the first X3 In-line X-Ray system in 2011, MatriX Technologies now presented its new X3L system in the USA. As of this year, besides the universal 3D inspection system X3, the X3L configuration is available with an innovative dual detector concept, combining a line-scan for transmission inspection of complete PCBs in a few seconds and a high-resolution digital flatpanel detector for selective 3D image capturing.
Industry News | 2013-03-28 11:03:15.0
Multitest, will present at the VOICE conference, scheduled to take place April 23-25, 2013 at the DoubleTree by Hilton Hotel in San Jose, CA. Meet Multitest’s experts to learn more about the company’s solutions, from wafer-level test to final test – for standard ICs and sensor packages.
Industry News | 2010-05-12 12:49:30.0
Garden Grove, CA — Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces its updated product catalog.
Industry News | 2012-07-25 15:16:14.0
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference
Industry News | 2013-04-10 11:30:23.0
VJ Electronix, Inc., announces a recent increase in demand for its Summit LX large format PCB rework systems in its fiscal first quarter.
Industry News | 2021-12-15 20:08:31.0
Siemens pressure transmitter is a kind of equipment which converts pressure into pneumatic signal or electric signal for control and remote transmission. It can convert the physical pressure parameters such as gas and liquid sensed by the load cell sensor into standard electrical signals (such as 4 ~ 20mADC), which can be supplied to the secondary instruments such as indicating alarm instrument, recorder and regulator for measurement, indication and process adjustment.
Industry News | 2013-04-11 18:53:28.0
Multitest, will present at the Teradyne Users Group Conference, scheduled to take place April 29-May 1, 2013 in Fort Worth, TX. Meet Multitest’s experts to learn more about the company’s solutions, from wafer-level test to final test – for standard ICs and sensor packages.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2015-11-01 18:33:22.0
Nordson EFD introduces a new series of pneumatic non-contact dispensing systems. The P-Jet and P-Dot valves and V100 controllers jet low- to high-viscosity fluids with great precision and repeatability. They are designed for use in many types of applications and multiple industries including automotive, electronics, aerospace, and medical.
