Industry News: battery spot (Page 2 of 2)

Viscom implements groundbreaking 3D technology across its entire product range

Industry News | 2018-11-14 15:34:52.0

Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.

Viscom AG

The necessity of X-ray inspection for SMT BGA soldering quality control

Industry News | 2021-06-10 02:42:13.0

With the advent of 5G, especially the high integration, high density, miniaturization of packaging, and high process requirements in the electronics industry, detection efficiency is particularly important. Many manufacturers are not particularly clear about what role X-Ray can play and how to use X-Ray to improve the process and reduce the defect rate. Most manufacturers buy X-Ray because of the needs of customers. Those who are forced to buy X-Ray alone do not actually understand the important role that X-Ray can play in the production line.

Unicomp Technology Co., Ltd

Yestech's AOI Role in Hazardous Area Instrument Manufacturing

Industry News | 2013-11-08 11:15:49.0

AOI can be a powerful tool when effective quality management becomes an absolute priority. Below, Andy Bonner, Managing Director at Cupio Yestech Europe demonstrates this with a look at BEKA associates, who are using AOI within their manufacturing operation producing display instruments certified for safe use within potentially hazardous areas..

Nordson YESTECH

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