Industry News | 2019-10-02 16:32:48.0
Nordson ASYMTEK is pleased to introduce its Panorama™ conformal coating line solutions, providing a balance of equipment and process control for optimal efficiency in automated conformal coating.
Industry News | 2014-03-19 07:37:44.0
For the first time ENGMATEC will be represented this year at a trade fair in the USA. In cooperation with Landrex Technologies the German company will exhibit at the APEX Expo, the premier event for the electronic industry.
Industry News | 2020-06-18 14:24:36.0
Test Research, Inc. is proud to present the new In-Circuit Tester (ICT) solution BSI Plus.
Industry News | 2022-04-06 10:17:53.0
Test Research, Inc. (TRI) proudly announces the launch of the high-density pin count In-Circuit Tester (ICT) TR8100H SII with vaccum fixture for full coverage testing.
Industry News | 2012-03-30 18:18:57.0
Seica China will be an exhibitor at the Nepcon Shanghai being held on April 25th to 27th. The featured systems in booth # 1 H70 will include the Pilot V8 Flying Prober and the RTE-200 System.
Industry News | 2018-06-24 07:46:24.0
series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. This time it will be managed by Viva Next> 6, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program. In addition to the Seica OEM products described below Seica will also exhibit semiconductor solutions from Crea, OSAI and Microtest.
Industry News | 2018-07-02 21:34:21.0
series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. This time it will be managed by Viva Next> 6, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program. In addition to the Seica OEM products described below Seica will also exhibit semiconductor solutions from Crea, OSAI and Microtest.
Industry News | 2021-04-20 03:05:11.0
X-RAY detection equipment is currently the market mainstream products of nondestructive testing equipment, compared with traditional visual inspection and AOI visual inspection,it has the characteristics of more transparent, more in-depth, it not only can detect the defects which inside of the product,but also can save the defect images, consistent product for numerous but product type, by calling the CNC program to complete the whole array detection.As shown in the picture below, after each product is arranged according to the matrix,a picture is taken of each node through CNC horizontal or longitudinal scanning,which can greatly shorten the detection time and is of great significance for off-line detection of large quantities.
Industry News | 2023-08-29 07:00:13.0
Test Research, Inc. (TRI) proudly introduces the new AOI TR7700 SIII Ultra.
Industry News | 2014-12-11 17:22:23.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), continues to meet the challenges for micro materials testing with the introduction of a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns.
