Industry News: bend (Page 1 of 9)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

SMTA International 2014 Best Papers Announced

Industry News | 2015-01-07 15:52:18.0

The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.

Surface Mount Technology Association (SMTA)

Nordson DAGE Introduces a New Method for Testing Thin Die in Accordance to the SEMI Standard G96-1014 Additional capability for Micro Materials Test applications on the 4000Plus platform

Industry News | 2014-12-11 17:22:23.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), continues to meet the challenges for micro materials testing with the introduction of a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns.

Nordson DAGE

KDPOF Enables Seamless Optical Networks Integration

Industry News | 2018-02-22 06:49:37.0

Plastic Optical Fiber Gains Ground for Gigabit Ethernet Connectivity in Vehicles

KDPOF

Why do you need Stiffeners on Flex PCB?

Industry News | 2019-11-05 22:16:43.0

Flex PCBs are thin, light weight and easy bending, this gives much difficulty in the process of component assembly. Stiffeners are used to reinforce those areas where components will be assembled. There are many different material can be used as stiffeners, like polyimide, kapton, FR-4, Aluminium, etc, designer need to select the right material based on their thickness and characteristics.

Headpcb

Vision enhanced materials testing

Industry News | 2016-11-02 11:13:40.0

The market leading bond tester Condor Sigma can be equipped with a camera to do motion and strain analysis. It includes a wide variety of visualization options.

XYZTEC bv

Thermostat

Industry News | 2021-06-03 00:36:52.0

Many people don't realize the importance that a thermostat plays a comfortable temperature in their home. When the AC or heater don't seem to be working right, it is often the last thing people think to check. Like anything else, your thermostat can wear out over time, making your HVAC system unable to properly heat and cool your home.

Quick Time Engineering Inc

Molex Copper Flex Products Invests in AOT

Industry News | 2006-11-09 12:31:53.0

NOVEMBER 9, 2006

Lloyd Doyle

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