Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2016-06-15 20:20:37.0
The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge. Ljupce Talevski, from Aluwave AB took first place. In second place was Ekatarina Stahlmann from Grundig Business Syst. Coming in third place was Conny Hielscher from Grundig Business Syst.
Industry News | 2018-10-18 08:55:30.0
Nitrogen Protection Reflow Oven
Industry News | 2009-01-23 19:18:23.0
You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2013-08-01 13:16:42.0
The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 17, 2013 as a focused symposium at SMTA International in Fort Worth, TX.
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
