Industry News: best solder paste sac 305 (Page 2 of 15)

High Thermal Impact Reliability BGA Sphere from SHENMAO

Industry News | 2022-07-16 08:39:50.0

SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.

Shenmao Technology Inc.

SHENMAO to Highlight High-Rel Solder Sphere and Thermal Fatigue Resistant Paste at APEX

Industry News | 2022-01-10 16:49:36.0

SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

Shenmao Technology Inc.

High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO

Industry News | 2022-10-11 17:22:18.0

SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.

Shenmao Technology Inc.

Indium Corporation's SACM™ Provides Superior Drop Shock Performance AND Thermal Cycling Reliability

Industry News | 2013-11-01 13:11:17.0

Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.

Indium Corporation

Cobar to Exhibit New Solder Wire and Paste Technologies at SMTA International

Industry News | 2013-09-13 13:33:38.0

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit in Booth #605 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

Balver Zinn

Indium Corporation Features SACm™ at NEPCON China

Industry News | 2014-04-03 13:47:58.0

Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.

Indium Corporation

High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO Wins 2023 NPI Award

Industry News | 2023-01-30 16:07:57.0

SHENMAO America, Inc. received a 2023 NPI Award in the category of Soldering Materials for its PF918-PW216 water-soluble high thermal impact reliability solder paste. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.

Shenmao Technology Inc.

SHENMAO to Exhibit New Solder Pastes with NeVo at productronica

Industry News | 2021-10-11 16:08:26.0

SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao's PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.

Shenmao Technology Inc.

The Balver Zinn Group to Showcase the Latest Solder Paste Technology at SMTAI

Industry News | 2014-08-25 12:36:56.0

The Balver Zinn Group announces that it will exhibit in Booth #115 at SMTA International, scheduled to take place Sep. 30-Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

Cobar Solder Products Inc.

AIM Solder’s NC259 Solder Paste Offers Superior Performance

Industry News | 2013-05-07 13:45:19.0

AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.

AIM Solder


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