Industry News | 2015-01-27 10:59:31.0
The Balver Zinn Group announces that Cobar Solder Products Inc. is sponsoring the fourth annual IPC APEX EXPO® Hand Soldering Competition, scheduled to take place Feb. 26, 2015 at the San Diego Convention Center in San Diego, CA. Cobar Solder Products is contributing Balver Zinn’s BRILLIANT B2012 SAC305 (SN97C) solder wire is halide-free, rosin-based and designed for manual and robotic soldering.
Industry News | 2014-11-22 07:42:40.0
FCT Assembly today announced plans to exhibit at the Space Coast and Tampa Bay Expo & Tech Forum, scheduled to take place Thursday, December 4, 2014 at the Park Inn by Radisson in Kissimmee, FL. Solder expert Rodney Wade will be available to discuss FCT’s NanoSlic® Gold stencil and line of solution-driven solder pastes.
Industry News | 2010-12-01 15:42:43.0
Christopher Associates introduces the S3X-BF70M and 200N series wafer bumping pastes. The pastes exhibit a high definition over time and at elevated temperatures.
Industry News | 2018-06-03 19:11:33.0
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
Industry News | 2017-11-03 09:46:42.0
The Balver Zinn Group announced that they will be sponsoring the IPC Hand Soldering Competition (IPC-HSC) scheduled to take place November 14-16, 2017 at Productronica - New Munich Trade Fair Centre in Munich, Germany. Balver Zinn will be providing BRILLIANT B2012 SAC305 (SN97C) solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2015-01-25 15:51:36.0
FCT Assembly today announced plans to exhibit at the SMTA Rocky Mountain Expo Tech Forum, scheduled to take place Wednesday, Jan. 28, 2015 at the West Club at Mile High Stadium in Denver, CO. Solder experts will be available to discuss FCT’s NanoSlic® Gold stencil and line of solution driven solder pastes.
Industry News | 2018-10-22 18:35:12.0
SHENMAO Technology today announced plans to exhibit at the International Wafer-Level Packaging Conference, scheduled to take place Oct. 23-25, 2018 at the DoubleTree by Hilton San Jose in California. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys.
Industry News | 2024-03-18 12:35:19.0
SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.
Industry News | 2023-12-18 13:13:45.0
SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.
Industry News | 2014-09-06 15:26:20.0
FCT Assembly today announced plans to exhibit at the SMTA Capital Expo & Tech Forum, scheduled to take place Tuesday, September 9, 2014 at the John Hopkins University/Applied Physics Lab in Laurel, MD.
