Industry News | 2009-10-16 19:20:15.0
GREELEY, CO — FCT Assembly announces that lab services are now offered at its Greeley, CO facility. Conventional 63/37, SN100C® lead-free and SAC305 alloys can be analyzed at the facility.
Industry News | 2013-11-14 18:14:55.0
Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Industry News | 2014-02-27 17:02:28.0
The Balver Zinn Group announces that it will exhibit in Booth #2714 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
Industry News | 2016-04-19 05:13:13.0
The Balver Zinn group announced that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place April 26-28, 2016. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2017-05-09 04:41:07.0
The Balver Zinn group announces that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place May 16-18, 2017. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2010-11-02 10:42:48.0
Christopher Associates today announced the US introduction of Koki’s S3X48-M500 and S3X48-M500C Printable No-Clean Lead-Free Solder Pastes. Originally designed and formulated for superior head-in-pillow performance, the pastes also exhibit exceptional wetting and printing.
Industry News | 2013-10-08 14:47:36.0
The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2023-09-25 17:55:00.0
Indium Corporation R&D Manager, Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang will present at the SMTA Empire Expo & Tech Forum on September 26 in Syracuse, NY. Also at the conference, Regional Sales Manager Emily Belfield will host a panel discussion, Generational Differences in Today's Workplace.
