Industry News | 2010-09-26 16:12:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.
Industry News | 2012-05-22 14:14:12.0
ACD,announced the purchase of a PDR IR-E3 Evolution 2000 BGA Rework System for ultimate performance in BGA rework.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2008-06-26 13:16:22.0
WILSONVILLE, Ore., June 26, 2008 � Mentor Graphics Corporation (Nasdaq: MENT) today announced the publication of a new book written by Charles Pfeil, engineering director of Mentor�s Systems Design Division, entitled BGA Breakouts and Routing, Effective Design Methods for Very Large BGA.
Industry News | 2001-02-26 11:18:45.0
Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.
Industry News | 2009-06-29 07:18:50.0
TORRANCE, CA — June 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it now carries HIROX’s MX-BGAZ II Lens for easy and accurate BGA exterior observation.
Industry News | 2019-08-29 21:58:20.0
PACE Worldwide and Cumberland Electronics have teamed up to host two separate Technical Workshops on "Non-Destructive BGA/Area Array Component Rework" on September 10th at ACI Technologies in Philadelphia PA, and on September 12th at the PACENTER Training Center in Elkridge MD.
Industry News | 2016-03-07 20:10:00.0
ViTrox Technologies today announced that it will exhibit in Booth #5667 at SEMICON China 2016, scheduled to take place March 15-17, 2016 at Shanghai New International Expo Centre. The highlights of the show will be the TR2000i, VR20 and Vs 3DBGA!
Industry News | 2002-07-29 14:37:41.0
Glenbrook Technologies has announced the availability of their training publication, "Rapid and Effective X-ray Inspection of BGAs, Using Signature Identification."
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
.jpg)
