Industry News | 2012-07-24 10:54:50.0
VJ Electronix, Incannounces that company President Don Naugler will present at the upcoming “Sharpening Your Tools-Area Array Technology”
Industry News | 2013-03-25 15:21:46.0
OK International’s Metcal brand today announced the schedule for its 2013 Spring series of BGA rework and repair seminars.
Industry News | 2014-05-08 10:42:32.0
Visual Inspection Instrument manufacturer Optilia Instruments AB announces the appointment of Ascentech LLC as North American Distributor. The agreement encompasses Optilia's BGA solder Inspection system and high-definition (full HD) camera inspection systems to the electronics manufacturing industry.
Industry News | 2018-07-19 20:30:51.0
SHENMAO America is pleased to introduce the PF606-PW215 water-soluble solder paste. The company offers a full line of water-soluble fluxes and solder pastes for SMT and IC packaging applications. SHENMAO provides halide-containing and halide-free fluxes for tin/lead as well as lead-free solder alloys.
Industry News | 2021-05-04 11:27:33.0
The Murray Percival Company today announced the sale of a Kurtz Ersa HR-550 BGA Rework System to Acromag, Inc.
Industry News | 2021-09-07 11:14:42.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-10-18 12:49:19.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
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