Industry News | 2007-11-30 10:12:19.0
Morganville, New Jersey, and Neptune, NJ, November 29, 2007 - CADParts & Consulting LLC, a leader in electronic and product design services and EdmondMarks Technologies, a leading provider of electronic manufacturing services (EMS) have formed a strategic alliance.
Industry News | 2008-04-23 20:01:36.0
The new View X x-ray system from Scienscope International is the latest in X-Ray inspection systems designed to inspect printed circuit boards for solder joint integrity. The View X x-ray system is a cost effective inspection solution for both OEM's and contract manufacturers alike.
Industry News | 2008-06-19 11:14:35.0
LOS ALAMITOS, CA � June 18, 2008 � Practical Components Inc., the leading supplier of dummy components, announces that in cases where only its mechanical characteristics are required, Practical Dummy Components can be used instead of live, functioning components. Because there is no expensive die inside the package, the cost for performing mechanical testing is significantly lower.
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
Industry News | 2011-10-03 17:04:22.0
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.
Industry News | 2011-10-28 20:29:08.0
ERSA is pleased to offer a free ERSA Mobile Scope with the purchase of an ERSA rework system. The ERSA Mobile Scope is a new portable video microscope designed to inspect hidden solder joints of ball grid arrays (BGAs), μBGAs, chip scale packages (CSPs) and flip chips.
Industry News | 2014-02-21 11:40:56.0
Metcal today announced that Paul Wood will present “Rework Challenges for Smart Phone & Tablets: Do it Right the First Time” during the Rework technical session at IPC APEX EXPO on Wednesday, March 26, 2014 from 1:30-3 p.m. at the Mandalay Bay Convention Center in Las Vegas, NV.
Industry News | 2021-03-30 16:42:31.0
Odyssey component lead tinning machines provide high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-08-13 08:37:00.0
Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits. The system can also verify the coating thickness. Defense base customers often require XRF verification testing of components after components have been processed through lead-free to leaded solder alloy exchange for tin mitigation applications. XRF testing may also be required to verify RoHS compliance of components that have been re-balled or re-processed for lead-free applications. In addition to XRF testing, Circuit Technology Center also supports ionic cleanliness testing, X-ray, Acoustic Microscopy, Solderability, and BGA ball shear testing services.
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
