Industry News: bga 0.6 (Page 1 of 1)

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres

Industry News | 2016-05-16 20:59:04.0

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.

Shenmao Technology Inc.

SHENMAO Exhibits at SEMICON WEST July 12-14, 2016 Booth # 6467 Introduces BGA and Micro BGA Solder Spheres

Industry News | 2016-07-02 06:40:16.0

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.

Shenmao Technology Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres

Industry News | 2016-05-16 16:16:21.0

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.

Shenmao Technology Inc.

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

Industry News | 2016-08-23 16:30:00.0

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.

Shenmao Technology Inc.

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