Industry News: bga 0.8mm (Page 1 of 1)

Prototype and Debug 96 ball BGA with Ease

Industry News | 2011-02-14 16:05:28.0

Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.

Ironwood Electronics

SAMSUNG Develops Low-Power 8Mb SRAM/64Mb NAND Flash Stacked MCP Memory Device

Industry News | 2001-08-10 07:53:10.0

SAMSUNG has shipped the first engineering samples of a MCP device integrating 64Mb NAND-type flash memory and 8Mb SRAM. * Cost#ffective optimal solution for 3G mobile phones. * Mass production set for the second quarter of 2001.

Samsung Electronics

ECT's Contact Solutions to Showcase ZIP® Family at BiTS™ Burn-In & Test Socket Workshop

Industry News | 2012-02-10 16:30:05.0

Everett Charles Technologies’ (ECT) Contact Solutions will highlight the ZIP® family at the upcoming Burn-In & Test Strategies Workshop.

Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)

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