Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2011-10-03 15:19:17.0
IPC invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit paper abstracts for IPC’s International Academic Paper Competition.
Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
Industry News | 2011-12-14 15:47:27.0
Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012.
Industry News | 2017-01-15 19:40:17.0
Scienscope International will exhibit in Booth #2887 at MD&M West, scheduled to take place Feb. 7-9, 2017 at the Anaheim Convention Center in CA. The Scienscope team will demonstrate the X-Scope 3000 X-ray system.
Industry News | 2002-07-25 15:33:58.0
Glenbrook Technologies has announced the availability of a newly developed large capacity, ultra-high resolution X-ray inspection system, "Oversized" Jewel box 90-C. The system facilitates x-ray inspection of larger assembled printed circuit boards (PCBs) up to 18" x 24".
Industry News | 2020-10-24 02:04:11.0
On November 3rd to 5th, 2020,Unicomp Technology will bring the latest technology and products to the ELECTRONIC SOUTH CHINA 2020,Welcome to visit the Unicomp Technology booth at 9D30,Hall 9. Shenzhen International Convention and Exhibition Center!
Industry News | 2013-09-03 14:27:38.0
The ÉOLANE Group is the 4th largest European electronic subcontractor, currently employing 3,000 personnel across 20 European facilities, with 10 sites manufacturing in France.
Industry News | 2019-01-05 08:00:24.0
PDR today announced plans to exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will introduce the PDR IR-E6S Evolution in Booth #1519. The new IR-E6S with Auto Lift will be available in February 2019.
Industry News | 2012-06-04 11:39:23.0
MARTIN has expanded its successful EXPERT 04.6 rework station series with a new configuration to rework LEDs and power components on heavy (metal or ceramic) boards.
