Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Industry News | 2003-04-14 09:17:40.0
AeA Micro Cap Virtual Conference to be held Online May 16th
Industry News | 2003-06-09 09:16:38.0
The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.
Industry News | 2003-06-23 09:04:32.0
China Replaces Japan and Mexico as Largest Supplier of Electronics to the United States
Industry News | 2003-04-03 08:51:07.0
Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming
Industry News | 2003-04-15 09:52:51.0
Announces a new region-based organizational structure
Industry News | 2003-06-25 12:40:26.0
to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2011-10-03 15:19:17.0
IPC invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit paper abstracts for IPC’s International Academic Paper Competition.
