Industry News | 2003-03-20 09:03:05.0
Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.
Industry News | 2013-07-17 19:05:42.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-07-19 11:33:18.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2003-02-18 09:39:06.0
Encourages You to Submit an Abstract for this Year's Conference
Industry News | 2009-04-15 23:01:13.0
BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2018-06-26 20:35:35.0
The SMTA is pleased to announce that the program and registration for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai. Taking place October 14-18, 2018 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2009-03-12 18:25:36.0
The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
