Industry News: bga and delamination (Page 11 of 24)

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces BGA and Micro BGA Solder Spheres

Industry News | 2016-05-16 20:59:04.0

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.

Shenmao Technology Inc.

SHENMAO Exhibits at SEMICON WEST July 12-14, 2016 Booth # 6467 Introduces BGA and Micro BGA Solder Spheres

Industry News | 2016-07-02 06:40:16.0

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.

Shenmao Technology Inc.

Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Industry News | 2009-12-14 20:45:09.0

December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).

Christopher Associates Inc.

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Ohio Valley Expo & Tech Forum

Industry News | 2010-06-30 12:09:49.0

MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Finetech

PDR Americas and Horizon to Discuss Versatile IR Rework System for Small to Large PCB Assemblies

Industry News | 2017-05-01 15:30:04.0

PDR is pleased to announce that Horizon Sales will discuss the IR-E6 Evolution XL rework system at the SMTA Michigan Expo & Tech Forum, scheduled to take place Thursday, May 11, 2017 at the Crossroads Conference Center in Grand Rapids, MI. Horizon Sales is PDR’s exclusive representative in the Midwestern U.S. The PDR IR-E6 SMD/BGA rework station, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.

PDR-America

New OK International Webinar teaches Convection and Conduction rework

Industry News | 2011-01-14 13:52:37.0

OK International is launching a brand new free webinar designed to help today’s manufacturers learn how to optimize their rework processes. Entitled ‘Reworking Components with Conduction and Convection: A Practical Tutorial’, the webinar will be held on February 2nd at 10am PST/1pm EST /6pm GMT and repeated on February 4th at 10am GMT/ 11am CET.

OK International

Factronix GmbH Becomes an Official KYZEN Partner and Distributor

Industry News | 2016-02-15 11:13:19.0

KYZEN is pleased to welcome aboard Factronix GmbH, a leading specialist in electronics assembly manufacturing. Factronix is now an official partner and distributor of KYZEN specialty cleaning products for the electronics and semiconductor industries.

KYZEN Corporation

Kester Launches NF372-TB Flux-Pen® and RF550 Rework Flux

Industry News | 2016-04-28 17:33:05.0

Kester is proud to announce the launch of NF372-TB Flux-Pen® and RF550 Rework Flux. These products were formulated to compliment Kester’s high-reliability, no-clean product line.

Kester

Indium Corporation to Host PCB and Component Defects Webinar

Industry News | 2020-08-22 04:07:55.0

Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).

Indium Corporation

Machine Vision Products to demonstrate Supra E AOI and Microelectronics inspection capabilities at Nepcon China 2012

Industry News | 2012-04-24 06:53:22.0

April 24, 2012.Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Ultra 850G Microelectronics AOI at Nepcon China in Shanghai from April 25th to April 27th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Stand 1C65.

Machine Vision Products, Inc


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