Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
Industry News | 2016-07-07 14:47:47.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2011-03-17 17:48:27.0
The OK International team will display and demonstrate its full range of soldering and production assembly technologies at this year’s IPC/APEX Expo in Las Vegas, April 12-14. These industry-leading solutions will be fully operational at booth # 1634, including advanced soldering, desoldering and rework systems, programmable pre-heaters, fume extraction and a comprehensive range of dispensing technologies.
Industry News | 2011-05-11 18:59:27.0
May 11, 2011 Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Microelectronics inspection capabilities at Nepcon China in Shanghai from May 11th to May 13th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at booth 4E23 Level 1B East Hall.
Industry News | 2013-06-12 11:38:59.0
STI Electronics, Inc. announces that it will exhibit at the SMTA Space Coast Expo & Tech Forum, scheduled to take place Thursday, June 13, 2013 at the Melbourne Auditorium in Melbourne, FL.
Industry News | 2013-09-12 14:29:04.0
STI Electronics, Inc. announces that it will exhibit in Booth #301 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2014-08-27 21:23:28.0
STI Electronics, Inc. announces that it will exhibit in Booth #412 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2018-06-03 19:11:33.0
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
Industry News | 2019-10-08 06:12:57.0
SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.
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