Industry News: bga and delamination (Page 14 of 23)

Advanced Liquid Flux and Low Temp Solder from SHENMAO at SMTA Silicon Valley Expo

Industry News | 2019-11-25 11:02:32.0

SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.

Shenmao Technology Inc.

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Industry News | 2021-01-17 17:50:26.0

The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Electronics Solutions

SHENMAO to Highlight High-Rel Solder Sphere and Thermal Fatigue Resistant Paste at APEX

Industry News | 2022-01-10 16:49:36.0

SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

Shenmao Technology Inc.

MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

Industry News | 2010-09-15 21:55:19.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

Finetech

See Christopher Associates’ World-Class Products and Technologies at the 2011 Assembly & Automation Technology Expo

Industry News | 2011-08-22 17:22:16.0

Christopher Associates will exhibit latest equipment and materials from its world-class suppliers in Booth #658 at the upcoming Assembly & Automation Technology Expo.

Christopher Associates Inc.

Multitest's Gemini™ Kelvin Is the Contactor of Choice for QFNs and BGAs

Industry News | 2011-11-27 00:38:42.0

Multitest announces that the usage of its Gemini™ Kelvin is rapidly increasing at two longstanding customers, both of which rank among the top 25 IDMs.

Multitest Elektronische Systeme GmbH

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum

Industry News | 2012-04-19 09:00:53.0

MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum,

MARTIN (a Finetech company)

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum

Industry News | 2012-05-31 21:36:12.0

MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum

Finetech

Metcal Will Exhibit Fume Extractors and Convection Rework Systems at SMTA LA/Orange County

Industry News | 2014-10-16 19:36:55.0

Metcal announces that it will exhibit at the SMTA LA/Orange County Expo & Tech Forum, scheduled to take place Thursday, November 6, 2014 at The Grand Event Center in Long Beach, CA.

Metcal


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