Industry News: bga and delamination (Page 15 of 23)

ERSASCOPE 2 Is the Only Optical Inspection System for Flip Chips and CSPs

Industry News | 2014-10-22 11:11:30.0

Kurtz Ersa North America announces that it has delivered the new ERSASCOPE 2 to ACME PCB Assembly.

kurtz ersa Corporation

MacDermid Alpha to Present Void Reduction and Silver Free Alloy Solutions at SMTA South China Technology Conference in Shenzhen

Industry News | 2020-08-22 04:19:37.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.

MacDermid Alpha Electronics Solutions

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 To Solve HoP Issues and Improve ICT Testability at SMTAI Exhibition

Industry News | 2017-09-12 20:15:18.0

SHENMAO Technology introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Industry News | 2017-11-28 09:32:15.0

SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

STI to Feature Company Services and Suppliers' Technologies at SMTA Huntsville

Industry News | 2009-04-13 16:21:36.0

MADISON, AL � April 2009 � STI Electronics Inc., a full service organization providing training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that the company's Industrial and Electronics Distribution division will feature numerous products, along with STI's Engineering and Training Services at the upcoming Huntsville Expo and Tech Forum, scheduled to take place Tuesday, April 14, 2009 at the Von Braun Center in Huntsville, Ala.

STI Electronics

PDR Americas Announces Show Special on Rework Innovations and Technology at SMTAI

Industry News | 2016-08-31 19:08:27.0

PDR Americas announced today that it will exhibit at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase its best-selling PDR Model E3Vi Gold and offer several show specials in Booth #202. Additionally, PDR will hold a drawing for a portable Coleman BBQ grill (Roadtrip LXE). Show specials include:

PDR-America

Nihon Superior to Present at the TMS 2008 Annual Meeting and Exposition

Industry News | 2008-03-05 22:38:31.0

OSAKA, JAPAN � March 5, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper, titled �High Impact Strength Tin-Copper Based Lead-free Solder Bump Alloys� authored by Tetsuro Nishimura, Shoichi Suenaga and Keith Sweatman, to the Technical Conference that is part of the TMS 2008 Annual Meeting and Exposition scheduled to take place March 9-13, 2008, in New Orleans, Louisiana.

Nihon Superior Co., Ltd.

Computrol to Highlight Medical and Manufacturing Services at MDM West 2011

Industry News | 2011-01-12 14:31:35.0

Computrol, Inc. announces that it will exhibit in Booth 2464 at the upcoming Medical Design & Manufacturing West conference and exposition, scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

Computrol, Inc.

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums

Industry News | 2011-02-17 14:59:07.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

Finetech

Order Solders, Stencils and More Direct from FCT Assembly’s New Online Storefront

Industry News | 2011-04-25 11:45:04.0

FCT Assembly introduces its new Web-based store, located at http://www.fctassembly.net. The newly developed storefront allows customers to purchase merchandise directly from the company online, significantly increasing user convenience.

FCT ASSEMBLY, INC.


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