Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2009-10-13 12:56:51.0
San Diego — October 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, in conjunction with Air-Vac Engineering Company will hold a free BGA Manufacturing and Repair Seminar at 6 p.m. on Friday, October 23, 2009 at the Hotel Radisson Case Grande, Ciudad Juarez in Juarez, Mexico.
Industry News | 2018-01-16 11:59:10.0
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The next webinar, Eliminate Printed Circuit Board Problems & Failure Modes will take place on January 23rd at 2:30 EST.
Industry News | 2013-03-25 15:21:46.0
OK International’s Metcal brand today announced the schedule for its 2013 Spring series of BGA rework and repair seminars.
Industry News | 2014-09-06 19:53:46.0
Metcal today announced that Ed Zamborsky, Eastern Regional Sales Manager, will speak at the Best Practices Workshop presented by Stanley Supply & Services and RESTronics.
Industry News | 2004-02-04 16:52:03.0
Prepare for the 2006 European Deadline
Industry News | 2016-09-21 15:33:30.0
Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
Industry News | 2007-11-30 10:12:19.0
Morganville, New Jersey, and Neptune, NJ, November 29, 2007 - CADParts & Consulting LLC, a leader in electronic and product design services and EdmondMarks Technologies, a leading provider of electronic manufacturing services (EMS) have formed a strategic alliance.
Industry News | 2021-03-30 16:42:31.0
Odyssey component lead tinning machines provide high reliability BGA alloy exchange and component re-finishing capabilities.
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