Industry News | 2016-08-29 18:40:48.0
Kurtz Ersa North America is pleased to announce that it will exhibit in Booth #1034 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Ersa’s team will demonstrate the HR 550 Rework system, Ersa Mobile Scope, i-CON VARIO 4 and Smartflow 2020.
Industry News | 2016-05-16 16:16:21.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
Industry News | 2021-11-14 21:01:12.0
Productronica 2021 is an innovative, unrivaled, and international event. This is one of its kind of events that showcase the entire value chain in the production industry of electronic goods – from technology and components to software and services, including supply chain, Stencil Screen Printer, Pick & Placer, SPI, Reflow over, X-Ray inspection, BGA repair and maintenance. As an international trade fair, Productronica Munich 2021 covers the entire range of present and futuristic products, technologies, and system solutions.
Industry News | 2014-04-08 09:39:42.0
Metcal today announced the venues for the next two stops on its 2014 rework tour.
Industry News | 2014-09-06 18:07:02.0
Metcal today announced that it will hold its next rework workshop in conjunction with Kester Solder.
Industry News | 2022-07-16 08:36:14.0
Test Research, Inc. (TRI) is pleased to announce plans to exhibit at the SMTA Queretaro Expo 2022, scheduled to take place on August 18, 2022, at the Mision Grand Juriquilla.
Industry News | 2018-09-18 20:27:42.0
PDR today announced plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will have the IR-C3 Chipmate Entry-Level SMD/BGA Rework Station and IR-E3 Evolution Series SMD/BGA IR Rework Station in Booth #527.
Industry News | 2011-10-03 17:04:22.0
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.
Industry News | 2004-06-24 17:35:13.0
New Lead-Free validation kit and service smoothes transition to "green" electronic assembly.
Industry News | 2010-08-27 07:25:03.0
Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.
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