Industry News | 2014-09-06 18:07:02.0
Metcal today announced that it will hold its next rework workshop in conjunction with Kester Solder.
Industry News | 2022-07-16 08:36:14.0
Test Research, Inc. (TRI) is pleased to announce plans to exhibit at the SMTA Queretaro Expo 2022, scheduled to take place on August 18, 2022, at the Mision Grand Juriquilla.
Industry News | 2018-09-18 20:27:42.0
PDR today announced plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will have the IR-C3 Chipmate Entry-Level SMD/BGA Rework Station and IR-E3 Evolution Series SMD/BGA IR Rework Station in Booth #527.
Industry News | 2011-10-03 17:04:22.0
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.
Industry News | 2004-06-24 17:35:13.0
New Lead-Free validation kit and service smoothes transition to "green" electronic assembly.
Industry News | 2023-10-02 09:57:38.0
KYZEN will exhibit at SMTA International from Oct. 9-12, 2023, at the Minneapolis Convention Center in Minnesota.
Industry News | 2010-08-27 07:25:03.0
Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.
Industry News | 2012-07-26 14:56:08.0
VJ Electronix, Inc. announces that company President Don Naugler will present at the upcoming “Sharpening Your Tools-Area Array Technology” symposium hosted by BEST, Inc.
Industry News | 2023-09-25 18:29:12.0
PDR is pleased to announce its participation in the SMTA Guadalajara Expo, scheduled to take place Wednesday, Oct. 25, 2023 in SMTVYS Technology's Booth 505 at Expo Guadalajara in Guadalajara, Jalisco. PDR is set to showcase its cutting-edge IR-E3 Series of SMD/BGA IR rework systems, as well as its industry-leading X-ray solutions.
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
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