Industry News: bga and popping (Page 1 of 35)

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

SMTA International Features Package-on-Package (PoP) Design and Assembly Center and Free Webinar

Industry News | 2012-07-12 10:34:27.0

The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.

Surface Mount Technology Association (SMTA)

SMTA International Features Package-on-Package (PoP) Design and Assembly Center and Free Webinar

Industry News | 2012-07-12 10:34:54.0

The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.

Surface Mount Technology Association (SMTA)

SMTA Boston Offers Flip Chip and BGA Workshop

Industry News | 2003-03-20 09:03:05.0

Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.

Surface Mount Technology Association (SMTA)

SMTA Boston Workshop, Courses, and Special Events

Industry News | 2003-04-21 09:12:57.0

June 9-11 at the Bayside Convention Center

Surface Mount Technology Association (SMTA)

FPGAs and Microcontrollers

Industry News | 2018-10-18 10:34:11.0

FPGAs and Microcontrollers

Flason Electronic Co.,limited

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

Practical Components to Highlight Latest Technology at SMTA International 2007

Industry News | 2007-10-04 23:11:30.0

LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.

Surface Mount Technology Association (SMTA)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2012-06-29 14:47:47.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open.

Surface Mount Technology Association (SMTA)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2012-06-30 16:45:46.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open.

Surface Mount Technology Association (SMTA)

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