Industry News: bga and reflow and temperature (Page 13 of 20)

Selective Soldering and Vacuum Reflow from the Technology Leader at NEPCON South China

Industry News | 2021-07-27 15:48:50.0

BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.

BTU International

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Industry News | 2021-10-07 15:29:25.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Industry News | 2022-10-06 18:19:54.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1230 at the SMTA International Exposition, scheduled to take place Nov. 2-3, 2022 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior Co., Ltd.

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Industry News | 2021-01-17 17:50:26.0

The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Electronics Solutions

Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech

Industry News | 2016-02-23 19:44:33.0

Akrometrix will exhibit in Booth #108 at the GOMACTech 2016 Conference, scheduled to take place March 14-17, 2016 in Orlando, Fl. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for government reviews.

Akrometrix

KIC to Showcase New Integrated Fixture and Profiler for Tracking Reflow Oven Stability at NEPCON China

Industry News | 2019-03-25 19:51:31.0

KIC today announced plans to exhibit in Booth 1G10 at NEPCON China, scheduled to take place April 24-26, 2019 at the Shanghai World Expo Exhibition & Convention Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0

KIC Thermal

Vitronics Soltec Products Win Two SMT China Vision Awards in Reflow and Selective Soldering Categories

Industry News | 2017-05-01 14:53:34.0

ITW EAE’s Vitronics Soltec earned two coveted VA Excellent Awards from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai. The CATHOX™ Catalytic Thermal Oxidizer was recognized in the Reflow Soldering category and the ZEVAm took the prize in the Selective Soldering category.

Vitronics Soltec

MacDermid Alpha Launches Ultra-Low Temperature Solder and 5G Solutions at Productronica China 2020

Industry News | 2020-06-24 15:22:46.0

The Assembly Solutions division of MacDermid Alpha Electronics Solutions will be introducing its ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.

MacDermid Alpha Electronics Solutions

New High Thermal & Impact Reliability Solder and Water Soluble Flux from SHENMAO

Industry News | 2018-06-03 19:11:33.0

SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.

Shenmao Technology Inc.

SHENMAO to Highlight High-Rel Solder Sphere and Thermal Fatigue Resistant Paste at APEX

Industry News | 2022-01-10 16:49:36.0

SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

Shenmao Technology Inc.


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