Industry News | 2010-05-29 18:57:32.0
MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry News | 2013-05-01 20:51:31.0
Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.
Industry News | 2011-02-14 16:05:28.0
Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.
Industry News | 2019-09-03 12:08:08.0
With the growing interest in the use of low temperature soldering and the use of solder paste in rework we have created the first training resources available to downoad at www.bobwillis.co.uk Training materials for use in your own onsite workshops or tailor made onsite hands on sessions. The training material feature training wall charts and a photo album of images to use in PowerPoint, reports or on websites
Industry News | 2003-05-05 08:32:30.0
Nepcon UK in Brighton will host the latest in electronics materials and electronics reliability measurement equipment from Concoat.
Industry News | 2009-10-13 12:56:51.0
San Diego — October 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, in conjunction with Air-Vac Engineering Company will hold a free BGA Manufacturing and Repair Seminar at 6 p.m. on Friday, October 23, 2009 at the Hotel Radisson Case Grande, Ciudad Juarez in Juarez, Mexico.
Industry News | 2018-03-25 13:21:16.0
The widest selection of online webinars in the industry has added more titles
Industry News | 2011-09-19 16:30:56.0
MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2010-06-30 12:09:49.0
MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
