Industry News: bga baking after wash (Page 1 of 1)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux

Industry News | 2015-10-22 16:43:19.0

SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

Shenmao Technology Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth 505 Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux

Industry News | 2016-05-24 20:29:22.0

SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

Shenmao Technology Inc.

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West 2016 Booth # 6467 in San Francisco

Industry News | 2016-07-11 20:50:22.0

SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

Shenmao Technology Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

Industry News | 2016-06-05 13:20:49.0

SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.

Shenmao Technology Inc.

Breakthrough Concept to Bond Circuit Board Jumper Wires

Industry News | 2008-11-12 20:09:45.0

November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.

Circuit Technology Center, Inc.

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