Industry News | 2009-03-19 00:43:07.0
TORRANCE, CA � March 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will honor the top three Sayaka Router Sales Representatives, as well as the top three McDry/Sawa Sales Representatives at the IPC/APEX conference and exhibition, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2015-11-30 12:28:54.0
Aegis Software will promote the latest version of their market leading software FactoryLogix at Business Software Event in Den Bosch, The Netherlands on December 1st, showing its ability to enable an Industry 4.0 or Smart Manufacturing solution across the entire enterprise. You can meet Dr Friedrich W. Nolting and Christian Teasdel of Aegis Software at booth 75.
Industry News | 2016-02-03 11:55:32.0
Aegis Software will present their market leading FactoryLogix R3 software at this year’s MDM West and Advanced Manufacturing Expo in Anaheim, California from February 9th to 11th. This 3rd release of their flagship solution embraces the principles of Industry 4.0 and IoM (Internet of Manufacturing) including resource scheduling, configure to order (CTO) and a standardized machine communication technology.
Industry News | 2016-02-11 22:57:15.0
Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.
Industry News | 2018-04-17 21:01:52.0
Seika Machinery today announced that all McDry cabinets will soon be able to maintain one percent RH levels with the new optimized drying units, like the McDry DXU-1001A UL Quick Dehumidifying Model. The McDry name is known for high performance, quality, and its market longevity.
Industry News | 2024-02-19 12:00:05.0
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.
Industry News | 2001-02-26 11:18:45.0
Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.
Industry News | 2022-07-16 08:39:50.0
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.
Industry News | 2008-06-26 13:16:22.0
WILSONVILLE, Ore., June 26, 2008 � Mentor Graphics Corporation (Nasdaq: MENT) today announced the publication of a new book written by Charles Pfeil, engineering director of Mentor�s Systems Design Division, entitled BGA Breakouts and Routing, Effective Design Methods for Very Large BGA.
Industry News | 2019-04-25 06:24:05.0
At April 24-26th, we are at Nepcon China in Shanghai show our newest BGA rework station and X-ray smd parts counter.
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