Industry News: bga ball attach (Page 1 of 44)

GPD Global's PCD Dispensing on Its MAX Series Platform Recognized with Two 2011 Global Technology Awards

Industry News | 2011-11-20 13:36:13.0

GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform

GPD Global

GPD Global's PCD Dispensing on Its MAX Series Platform Wins Another Industry Award

Industry News | 2012-03-05 14:26:45.0

GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.

GPD Global

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

Circuit World Announces License of Channel Routing Technology from Nortel Networks

Industry News | 2003-06-25 12:40:26.0

to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks

SMTnet

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

IPC’s Revised BGA Guideline Features Expanded Focus on Mechanical Reliability

Industry News | 2013-01-30 17:54:43.0

Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Association Connecting Electronics Industries (IPC)

Precision PCB Services, Inc. adds Side View Camera to their BGA Rework Stations

Industry News | 2018-07-16 17:50:00.0

Side View Camera now available with all BGA Rework Stations

Precision PCB Services, Inc

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Industry News | 2020-03-19 11:12:48.0

Amid the COVID 19 crisis, Precision PCB Services, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern California and Dallas, Texas.

Precision PCB Services, Inc

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