Industry News: bga ball bridge (Page 13 of 35)

CIRCOR Aerospace Purchases Hentec/RPS 1325 Odyssey Lead Tinning System

Industry News | 2021-09-07 11:14:42.0

Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

CiRCLE Engineers Purchases Hentec/RPS 1325 Odyssey Lead Tinning System for Israel Facility

Industry News | 2021-10-18 12:49:19.0

Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

Holt Integrated Circuits Finalizes Purchase of Hentec/RPS Odyssey 1325 Lead Tinning System

Industry News | 2022-03-07 16:53:18.0

Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

PDR Rework Welcomes Leo Gibbs as Commercial Director

Industry News | 2024-03-26 13:10:05.0

PDR Rework proudly announces the appointment of Leo Gibbs as the Commercial Director. In his new role, Gibbs will play a pivotal part in steering the company's commercial strategies, further solidifying PDR Rework's position as an industry leader in advanced rework solutions.

PDR Rework

Bob Willis PoP and BGA Inspection Webinars sponsored by Nordson DAGE

Industry News | 2010-08-27 07:25:03.0

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.

ASKbobwillis.com

Soldering, Coating, Cleaning and PCB Process Failures from the Desk of Bob Willis

Industry News | 2018-03-25 13:21:16.0

The widest selection of online webinars in the industry has added more titles

ASKbobwillis.com

SemiPack Invests in Additional Hentec/RPS Photon Steam Aging System

Industry News | 2021-05-18 14:19:48.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

Circuit Technology Center Announces New Component Trim and Form Service

Industry News | 2023-11-13 12:31:47.0

Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.

Circuit Technology Center, Inc.

Machine Vision Products to Demonstrate Diverse Microelectronics and Packaging Inspection Toolbox of its Microelectronics AOI Platforms at Semicon West 2016

Industry News | 2016-07-08 19:09:41.0

Carlsbad, CA – July 8: Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall.

Machine Vision Products, Inc

Machine Vision Products to Introduce their latest Die Wire, Wire-Bond Inspection and Automated Semiconductor Inspection Solutions at Semicon West 2017

Industry News | 2017-07-07 17:15:03.0

Carlsbad, CA – July 7, 2017: Machine Vision Products (MVP) today announced it would be demonstrating its Die Wire Metrology System (DWMS) and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition. These latest capabilities are available on MVP's 2020 and 850G Platforms. Applications demonstrated will include die wire metrology, wire bond, wafer and surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 11-13, 2017. Machine Vision Products are exhibiting at booth #7724 in the West Hall (Level 1).

Machine Vision Products, Inc


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