Industry News: bga ball bridge (Page 17 of 36)

PACE Offers 10 Free Nozzles with the Purchase of New TF 1800 BGA Rework System

Industry News | 2016-10-26 14:55:50.0

Vass, NC – Sept 20, 2016 – PACE Worldwide announces an introductory promotion in conjunction with the launch of their new TF 1800 BGA/SMD Rework System, which began shipping in October. For a limited time, PACE will provide 10 Heat Focusing Nozzles free of charge with the purchase of each TF 1800 System, a value of over $3,400 (£2,700/€3,340).

PACE Worldwide

PACE to Showcase New TF Series of BGA Rework Systems at IPC APEX EXPO 2019

Industry News | 2019-01-22 13:06:44.0

At IPC Apex 2019, PACE Worldwide will showcase their new TF Series of BGA Rework Systems. The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”. The TF1800 will be on display at our booth (#2809) and will be available for live demonstrations.

PACE Worldwide

SHENMAO to Debut New Pastes & Fluxes at electronica China

Industry News | 2019-03-05 17:59:34.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.

Shenmao Technology Inc.

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Industry News | 2014-09-22 10:40:15.0

YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

YINCAE Advanced Materials, LLC.

Practical Components Adds 0.3 mm Pitch Dummy CVBGA Test Vehicle to Lineup

Industry News | 2011-11-08 14:17:32.0

Practical Components introduces a dummy (mechanical sample) version of Amkor’s cutting-edge CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT).

Practical Components, Inc.

Practical Components to Display Its Latest Products at the IPC APEX EXPO

Industry News | 2013-02-04 14:14:48.0

Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo

Practical Components, Inc.

FINE LINE STENCIL Stays at the Top of the Industry with Its Technical Support Services

Industry News | 2008-06-13 16:32:11.0

COLORADO SPRINGS, CO � June 12, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, believes that customer service is key to staying successful in today�s industry. It accomplishes this with the help of its Value Added Technical Support Team.

FCT ASSEMBLY, INC.

Nihon Superior Introduces NS-F850 Flux for Lead-Free Wave Soldering

Industry News | 2009-01-23 02:17:04.0

OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces NS-F850 rosin-based flux for lead-free wave soldering.

Nihon Superior Co., Ltd.

Nihon Superior's NS-F850 Wins a 2009 NPI Award

Industry News | 2009-04-08 20:51:10.0

OSAKA, JAPAN � March 2009 � Nihon Superior announces that it has been awarded a NPI Award in the category of Flux for its NS-F850. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.

Nihon Superior Co., Ltd.

SEHO Academy to Host a Selective Soldering Seminar

Industry News | 2011-04-27 18:38:35.0

SEHO North America, Inc. announces a one-day Selective Soldering Seminar from the SEHO Academy presented by Dr. Ronny Horn, and scheduled to take place Wednesday, June 29 or Friday, July 1, 2011 at its facility near Cincinnati.

SEHO Systems GmbH


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