Industry News | 2011-01-14 13:06:07.0
Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Industry News | 2011-03-14 17:59:18.0
Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2022-01-24 18:01:46.0
Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.
Industry News | 2008-01-28 23:33:58.0
Agilent Technologies Inc. (NYSE: A) today unveiled the industry's first DDR2 and DDR3 ball-grid array (BGA) probes for oscilloscopes and logic analyzers. The probes will be shown for the first time at DesignCon, here in Santa Clara, Feb. 4-6, 2008, Booth 305.
Industry News | 2021-05-04 13:53:27.0
Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2017-01-24 10:55:12.0
BP 256 is YINCAE’s new ball attach adhesive product
Industry News | 2011-03-28 11:42:40.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of three new low cost I/O Breakout Boards: the MachXO™ 2280 Breakout Board, the ispMACH® 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board.
Industry News | 2007-02-28 21:19:00.0
EdmondMarks Technologies is opening a new EMS facility in Neptune, New Jersey.
Industry News | 2021-08-25 16:20:31.0
Two additional Hentec/RPS Odyssey 1325 RHSD machines will expand high reliability BGA alloy exchange and component re-finishing capabilities.
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