Industry News | 2011-09-23 22:09:26.0
Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.
Industry News | 2021-02-09 12:28:27.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities
Industry News | 2023-10-31 18:58:18.0
SHENMAO America, Inc. is proud to announce that it received a 2023 Mexico Technology Award for its groundbreaking SMBF-08 Visible No-Clean BGA Flux. The award was announced at a ceremony on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo. This innovative flux has redefined surface mount technology (SMT) assembly and BGA ball mount processes, offering unparalleled visibility and performance.
Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
Industry News | 2004-11-10 18:04:10.0
Frenchtown, NJ, November 2004
Industry News | 2014-10-13 16:23:05.0
Nikon Metrology will be presenting Inspect-X 4.1 at Electronica Munich from 11-14 November, their latest release of the acquisition and analysis software for Nikon Metrology's range of X-ray and CT systems. The new technology provides improved real-time imaging and advanced BGA analysis.
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2008-06-26 13:16:22.0
WILSONVILLE, Ore., June 26, 2008 � Mentor Graphics Corporation (Nasdaq: MENT) today announced the publication of a new book written by Charles Pfeil, engineering director of Mentor�s Systems Design Division, entitled BGA Breakouts and Routing, Effective Design Methods for Very Large BGA.
Industry News | 2010-03-04 11:30:26.0
POWAY, CA — March 2010 — EasySpheres recently finalized and opened an enhanced Web-based ordering portal for customers interested in purchasing solder balls and/or solder spheres for BGA rework applications and low-volume manufacturing.
