Industry News: bga connections (Page 1 of 10)

Ball Grid Array Inspection

Industry News | 2018-10-18 09:58:15.0

Ball Grid Array Inspection

Flason Electronic Co.,limited

What is a Ball Grid Array?

Industry News | 2018-10-18 10:22:15.0

What is a Ball Grid Array?

Flason Electronic Co.,limited

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

Five IPC APEX EXPO Exhibiting Companies Earn 2019 Innovation Awards Winners push boundaries of technology with innovative product submissions

Industry News | 2019-01-12 07:42:28.0

IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

How does PCB X-Ray Inspection Work?

Industry News | 2018-10-18 10:02:00.0

How does PCB X-Ray Inspection Work?

Flason Electronic Co.,limited

IPC’s Revised BGA Guideline Features Expanded Focus on Mechanical Reliability

Industry News | 2013-01-30 17:54:43.0

Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Association Connecting Electronics Industries (IPC)

Exposed Vias in BGA Pads

Industry News | 2018-10-18 10:26:46.0

Exposed Vias in BGA Pads

Flason Electronic Co.,limited

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited

Call For Papers Issued For IPC Annual Meeting Technical Conference

Industry News | 2001-02-27 22:31:53.0

IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.

Association Connecting Electronics Industries (IPC)

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