Industry News | 2003-04-17 11:32:31.0
Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2017-01-05 04:27:37.0
BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:
Industry News | 2017-02-10 21:25:25.0
Carlsbad, CA – February 10, 2017. Machine Vision Products (MVP), a leader in Automated Optical Inspection will be demonstrating AOI solutions for SMT and Microelectronics, 3D AOI and advanced software products at IPC APEX EXPO 2017 at the San Diego Convention Center from February 14 to 16. MVP is exhibiting at Booth #2509.
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2011-02-14 14:35:18.0
Christopher Associates/Koki Solder announces that Jasbir Bath, Consulting Engineer, will give a presentation about Head-in-Pillow Component Soldering Defects at the upcoming LA/O.C. SMTA Chapter Dinner, scheduled to take place Thursday, February 17, 2011 at JT Schmid’s Restaurant & Brewery in Anaheim, CA at 7 p.m.
Industry News | 2014-10-12 20:17:13.0
ACD, a full-service EMS company, is pleased to welcome MIRTEC customers to its facility for demonstrations.
Industry News | 2016-02-17 17:30:41.0
Nordson YESTECH announced today that they will launch their latest innovation in 3D inspection in Booth #1745 at the IPC APEX EXPO, scheduled to take place in Las Vegas, USA from 15th – 17th March 2016.
Industry News | 2017-11-09 14:55:51.0
BPM Microsystems is demonstrating its new 4900 automated programming system at Productronica. The 4900, with its advanced chip-scale part (CSP) device handling, on-the-fly vision alignment, and HS400 programming speeds, satisfies a vast range of programming needs in one automated system. Featuring high-performance laser marking and 3D inspection, the 4900 provides advanced serialization and quality control, meeting the highest programming and cyber security standards for automotive, aerospace, medical, industrial and mobile device industries.
Industry News | 2016-04-04 09:33:43.0
Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.
