Industry News: bga corner bonding (Page 11 of 14)

Indium Corporation Experts to Present at EPTC

Industry News | 2021-11-22 06:40:32.0

Three Indium Corporation experts will present on the evolution of high-temperature lead-free solders, thermal management challenges for advanced packaging, and give a sponsored presentation on the company's high-performance, high-reliability materials during the virtual Electronics Packaging Technology Conference (EPTC), Dec. 1-3.

Indium Corporation

Seika Machinery to Exhibit at SMTA Dallas 2009

Industry News | 2009-03-02 00:10:24.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.

Seika Machinery, Inc.

Machine Vision Products to Introduce their latest Die Wire, Wire-Bond Inspection and Automated Semiconductor Inspection Solutions at Semicon West 2017

Industry News | 2017-07-07 17:15:03.0

Carlsbad, CA – July 7, 2017: Machine Vision Products (MVP) today announced it would be demonstrating its Die Wire Metrology System (DWMS) and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition. These latest capabilities are available on MVP's 2020 and 850G Platforms. Applications demonstrated will include die wire metrology, wire bond, wafer and surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 11-13, 2017. Machine Vision Products are exhibiting at booth #7724 in the West Hall (Level 1).

Machine Vision Products, Inc

Inspection System Can See Under BGAs

Industry News | 2003-04-07 11:00:15.0

The innovative VPI-1000 optical inspection system is the only benchtop SMT inspection system capable of inspecting BGA devices as standard, without necessitating a lengthy lens reconfiguration.

Metcal

Machine Vision Products to demonstrate complete AOI solutions at APEX 2011

Industry News | 2011-04-05 21:42:34.0

Machine Vision Products (MVP) will be demonstrating its expanded range of AOI systems at APEX 2011 in Las Vegas. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Booth 1647.

Machine Vision Products, Inc

Finetech to Exhibit at NEPCON China 2011

Industry News | 2011-04-20 16:31:45.0

Finetech, a world leading equipment manufacturer of advanced rework solutions, will present two rework systems for professional rework applications in booth 2D10-A at NEPCON China 2011.

Finetech

Heraeus Electronics provides latest materials portfolio for next-generation power electronics and semiconductor advanced packaging at NEPCON Japan 2023

Industry News | 2023-01-23 18:38:38.0

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Heraeus

Nordson DAGE’s Evstatin Krastev, Ph.D. to present at SMTA International 20132D/3D X-Ray Inspection: Process Control and Development Tool technical paper to be discussed

Industry News | 2013-09-16 14:19:30.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is delighted to announce that Evstatin Krastev, Ph.D., partnered with Zhen (Jane) Feng, Ph. D., Tho Vu, Michael Xie, David A. Geiger and Murad Kurwa of FLEXTRONICS International Inc., and Zohair Mehkri of Santa Clara University, will be presenting their paper titled, “2D/3D X-Ray Inspection: Process Control and Development Tool” during technical session PRC2 Imaging, Inspection and Quality at the upcoming SMTA International in Fort Worth Texas.

Nordson DAGE

PEMTRON Sparks Innovation with World-Class Inspection Systems at SMTconnect 2024

Industry News | 2024-05-20 10:30:03.0

PEMTRON EUROPE is pleased to announce its participation in the upcoming SMTconnect, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. See the invisible world in Hall 4A, Stand 245 – Visitors can expect to see PEMTRON's latest advancements in inspection systems, including the Saturn 3D Inline Solder Paste Inspection System, Athena TPI Press-fit 3D Automated Optical Inspection System, TWIN Top/Bottom Double Sided Simultaneous 3D Automated Optical Inspection System, and TROI 8800 CI Series Conformal Coating Inspection System.

Pemtron

Nordson DAGE to Introduce X-Plane™ to the U.S. Market for the First Time at the 2012 IPC APEX Expo

Industry News | 2012-01-17 16:27:31.0

Nordson DAGE will introduce X-Plane™ to the U.S. market for the first time in Booth #3208 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Nordson DAGE


bga corner bonding searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
PCB Handling with CE

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
Fluid Dispensing, Staking, TIM, Solder Paste

Software for SMT placement & AOI - Free Download.
High Throughput Reflow Oven

High Precision Fluid Dispensers