Industry News | 2021-01-17 17:50:26.0
The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Industry News | 2022-09-15 06:27:38.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.
Industry News | 2017-10-18 20:31:57.0
YXLON International is pleased to announce that Keith Bryant, Global Direcompany of the Swiss tech holding, Comet Grouptor Electronics Sales, has been selected to present during productronica Messe München in Germany. Bryant will speak during the SMTA Technical Program in the SMT Speakers Corner (A1.220) on Thursday, Nov. 16, 2017 from 1-1:30 p.m. The presentation will look at the advantages that cross over X-ray systems, like the YXLON FF35 CT, bring to CT imaging in electronics failure analysis and in-depth fault finding. Bryant will discuss the latest technologies and show stunning reconstructions.
Industry News | 2021-11-12 04:07:03.0
Circuit Technology Center announces it has released an updated version of its popular Bonding System.
Industry News | 2010-05-24 23:09:12.0
FINETECH will exhibit in booth 403 at the Technology Corner of the Electronic Components and Technology Conference (ECTC), scheduled to take place June 2-3, 2010 at the Paris Las Vegas Hotel in Las Vegas.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2009-09-23 21:53:53.0
Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
Industry News | 2015-04-15 19:00:42.0
Rocket EMS today announced it has further enhanced its already impressive rework and special project capabilities with the purchase of the AIR-VAC DRS27 Large Format BGA Rework Station. The DRS27 provides Rocket EMS with unparalleled precision and flexibility for rework and assembly of BGAs, QFNs, CSPs, flip chips, PoP assemblies, 01005s and more.
Industry News | 2023-10-23 09:52:43.0
TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.
