Industry News | 2015-04-15 19:00:42.0
Rocket EMS today announced it has further enhanced its already impressive rework and special project capabilities with the purchase of the AIR-VAC DRS27 Large Format BGA Rework Station. The DRS27 provides Rocket EMS with unparalleled precision and flexibility for rework and assembly of BGAs, QFNs, CSPs, flip chips, PoP assemblies, 01005s and more.
Industry News | 2023-10-23 09:52:43.0
TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.
Circuit Technology Center, Inc.
Industry News | 2008-04-29 22:48:29.0
LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will host an open house and the SMTA Boston Chapter meeting at its Littleton facility from 5:30-9 p.m. on Tuesday, May 20, 2008.
Industry News | 2023-04-03 13:29:59.0
VJ Electronix, Inc. today announced the launch of its LT120 Rework System. Carrying on the Summit line of highly robust systems, the new LT120 is positioned to be able to work with very large BGA components on large PCBs.
Industry News | 2017-08-08 09:40:33.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
Industry News | 2017-08-08 09:40:36.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
Industry News | 2011-09-23 22:09:26.0
Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.
Industry News | 2021-02-24 11:47:14.0
YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.
