Industry News: bga corner bonding (Page 3 of 14)

VJ Electronix To Host Upcoming SMTA Meeting

Industry News | 2008-04-29 22:48:29.0

LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will host an open house and the SMTA Boston Chapter meeting at its Littleton facility from 5:30-9 p.m. on Tuesday, May 20, 2008.

VJ Electronix

VJ Electronix Launches Rework System for Servers, Backplanes & Extra Large Boards

Industry News | 2023-04-03 13:29:59.0

VJ Electronix, Inc. today announced the launch of its LT120 Rework System. Carrying on the Summit line of highly robust systems, the new LT120 is positioned to be able to work with very large BGA components on large PCBs.

VJ Electronix

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Industry News | 2017-08-08 09:40:33.0

(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

YINCAE Advanced Materials, LLC.

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Industry News | 2017-08-08 09:40:36.0

(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

YINCAE Advanced Materials, LLC.

Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Industry News | 2011-09-23 22:09:26.0

Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.

Nordson DAGE

YINCAE's New SMT 158N Series withstanding -273°C

Industry News | 2021-02-24 11:47:14.0

YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.

YINCAE Advanced Materials, LLC.

Cognex Corporation Enters Into $1.3 Million OEM Agreement with Alphasem AG

Industry News | 2002-04-24 08:49:13.0

Alphasem Expects to Purchase Approximately $1.3 Million of Cognex's MVS 8100 Machine Vision Systems Over the Next 18 Months

Cognex Corporation

Breakthrough Concept to Bond Circuit Board Jumper Wires

Industry News | 2008-11-12 20:09:45.0

November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.

Circuit Technology Center, Inc.


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