Industry News: bga corner bonding (Page 9 of 12)

Nordson DAGE Launches Explorer one Compact X-ray Inspection System

Industry News | 2019-05-15 17:22:53.0

Nordson DAGE announces the launch of the Nordson DAGE Explorer™ one super compact X-ray inspection system. Designed specifically for the electronics industry with Nordson DAGE’s unique integrated imaging technology, the new Explorer one offers market leading image quality allowing features as small as 2 µm to be seen. Typical applications include BGA reflow inspection, PTH solder fill inspection, counterfeit component screening, cable quality inspection and QFN and QFP solder quality.

Nordson DAGE

Indium Corporation Experts to Present at EPTC

Industry News | 2021-11-22 06:40:32.0

Three Indium Corporation experts will present on the evolution of high-temperature lead-free solders, thermal management challenges for advanced packaging, and give a sponsored presentation on the company's high-performance, high-reliability materials during the virtual Electronics Packaging Technology Conference (EPTC), Dec. 1-3.

Indium Corporation

Machine Vision Products to Introduce their latest Die Wire, Wire-Bond Inspection and Automated Semiconductor Inspection Solutions at Semicon West 2017

Industry News | 2017-07-07 17:15:03.0

Carlsbad, CA – July 7, 2017: Machine Vision Products (MVP) today announced it would be demonstrating its Die Wire Metrology System (DWMS) and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition. These latest capabilities are available on MVP's 2020 and 850G Platforms. Applications demonstrated will include die wire metrology, wire bond, wafer and surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 11-13, 2017. Machine Vision Products are exhibiting at booth #7724 in the West Hall (Level 1).

Machine Vision Products, Inc

Seika Machinery to Exhibit at SMTA Dallas 2009

Industry News | 2009-03-02 00:10:24.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.

Seika Machinery, Inc.

Inspection System Can See Under BGAs

Industry News | 2003-04-07 11:00:15.0

The innovative VPI-1000 optical inspection system is the only benchtop SMT inspection system capable of inspecting BGA devices as standard, without necessitating a lengthy lens reconfiguration.

Metcal

Machine Vision Products to demonstrate complete AOI solutions at APEX 2011

Industry News | 2011-04-05 21:42:34.0

Machine Vision Products (MVP) will be demonstrating its expanded range of AOI systems at APEX 2011 in Las Vegas. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Booth 1647.

Machine Vision Products, Inc

Finetech to Exhibit at NEPCON China 2011

Industry News | 2011-04-20 16:31:45.0

Finetech, a world leading equipment manufacturer of advanced rework solutions, will present two rework systems for professional rework applications in booth 2D10-A at NEPCON China 2011.

Finetech

Nordson DAGE to Introduce X-Plane™ to the U.S. Market for the First Time at the 2012 IPC APEX Expo

Industry News | 2012-01-17 16:27:31.0

Nordson DAGE will introduce X-Plane™ to the U.S. market for the first time in Booth #3208 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Nordson DAGE

Nordson DAGE to Exhibit at NEW South Africa 2012

Industry News | 2012-03-08 21:29:50.0

Nordson DAGE will highlight its new X-Plane™ technology in Stand C7 at the upcoming National Electronics Week (NEW) South Africa, scheduled to take place March 13-14, 2012 at the Sandton Convention Center in Johannesburg.

Nordson DAGE

New X-Plane™ Technology from Nordson DAGE Earns a 2012 Innovation Award during NEPCON China

Industry News | 2012-04-27 13:32:30.0

Nordson DAGE has been awarded a 2012 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AXI for its new X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.

Nordson DAGE


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