Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2011-02-17 14:59:07.0
MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.
Industry News | 2012-09-10 09:15:27.0
MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Industry News | 2013-05-28 14:45:16.0
Finetech & Martin announce the appointment of Al Cabral as Regional Sales Manager.
Industry News | 2014-09-22 10:40:15.0
YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.
Industry News | 2015-01-05 19:59:08.0
Metcal is pleased to introduce the new MX-HPDC dual cartridge hand-piece and MX-WHPDC work-stand. Designed to meet higher thermal demands, five new SMTC dual-shaft cartridge geometries also are available in two temperature series.
Industry News | 2016-06-28 15:44:10.0
ASC International today announced that it is collaborating with Unicomp Technologies to highlight X-ray equipment at the SMTA Upper Midwest Expo, scheduled to take place Thursday, June 30, 2016 at the Minneapolis Marriot Southwest Hotel in Minnetonka, MN.
Industry News | 2016-11-01 19:22:40.0
ASC International today announced that it will be collaborating with Unicomp Technologies to highlight X-ray equipment at the SMTA New England Expo, scheduled to take place Thursday, Nov. 3, 2016 at the DCU Center in Worcester, MA.
Industry News | 2016-04-04 09:33:43.0
Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.
Industry News | 2019-05-15 17:22:53.0
Nordson DAGE announces the launch of the Nordson DAGE Explorer™ one super compact X-ray inspection system. Designed specifically for the electronics industry with Nordson DAGE’s unique integrated imaging technology, the new Explorer one offers market leading image quality allowing features as small as 2 µm to be seen. Typical applications include BGA reflow inspection, PTH solder fill inspection, counterfeit component screening, cable quality inspection and QFN and QFP solder quality.
